Bridglets™
A Bridgelet is a small, purpose built Chiplet that enables two Chiplets that use different Die2Die (D2D) interfaces to interconnect. This provides customers the ability to leverage current designs but unlock performance improvements and power savings. CrossFire’s first Bridgelet will be a DCI to UCIe device.
This device will enable CrossFire customers that have integrated DCI connectivity into their Chiplets to connect to Chiplets equipped with the standard high power, low density UCIe interface.
Direct chiplet interface™ IP
Direct Chiplet Interface (DCI™) IP Cores are available, standalone, for integration into a customer’s Chiplet Design or as part of CrossFire’s Bridgelet die that can be used to bridge between different D2D interfaces.
An optimum deployment of DCI in a Chipletized system would implement full DCI interfaces on all Chiplets. CrossFire plans to offer DCI in most flavors of TSMC silicon at 7nm and below. Other processes are also under consideration, please email us at sales@crossfire-tech.com for more information.
Customers can also utlize DCI in a multi-Chiplet system with limited DCI connectivity by working directly with CrossFire to optimize the other Chiplets via CrossFire’s proprietary post fab die processing capabilities. This will provide some lower power and improved performance benefits.
CrossFire will also consider working with a customer / standards body for a custom implementations of DCI - for example:
To reduce the power and die area of the proprietary interface of an Integrated Device Manufacturer (IDM) or Fabless Semiconductor Company.
To enable the use of standard “on-chip” fabric interfaces such as CHI or VCIX in Chipletized environments.
Improving the performance metrics of a standard off-chip interface such as CXL in a Chipletized environment