Bridglets™
CrossFire’s Bridgelet™ products provide the Chiplet to Chiplet interconnect currently provided by Interposers, but without the cost, complexity or availability limitations. Depending on system requirements, Bridgelets can be either passive or active. Passive Bridgelets interconnect Chiplets down to 10µ pitches in 2.x D topologies. Active Bridgelets are capable of greater than 10x increases in pitch density, achieving sub-micron pitches. Bridgelets are compatible with industry standard Die to Die (D2D) PHY’s such as UCIe and Bunch of Wires (BoW). Proprietary and non-standard solutions such as Ultra Short Reach SerDes can also be used with Bridgelets.
Direct chiplet input / output™ IP
Current D2D PHYs contain unnecessary and burdensome features such as needlessly robust Electrostatic Discharge (ESD) protection, large pad sizes required by Interposer assembly techniques, overpowered Input / Output drivers, and signal conditioning circuitry. To address these pain points, CrossFire developed a Chiplet Input / Output solution called Direct Chiplet Input / Output or DCIO™. Compatible with standard link layers such as UCIe and the BoW link layer, implementations such as UCIe over DCIO can provide solutions that are 10x lower power, 10x lower cost, and 10x higher density than competing solutions
DCIO IP Cores are available, standalone, for integration into a customer’s Chiplet Design or as part of CrossFire’s Bridgelet die that can be used to bridge between different D2D interfaces.