OMNIlithic™ Technology
CrossFire's OmniDie™ and Organic Interconnect Bridge™ (OIB™) offerings are enabled by CrossFiire’s OmniLithic™ Technology. This new technology enables a superset of all the Monolithic Chiplets used in an ASIC or SoC design integrated into an OmniDie, regardless of which foundries manufactured the Chiplets or which technology nodes were used. The size of an OmniDie is limited only by the capabilities of the wafer processing equipment, not the maximum reticule size.
Crossfire’s OmniLithic technology creates reconstituted wafers from heterogeneous semiconductor die and discrete components such as chip resistors and capacitors. The wafer is then processed with standard semiconductor back-end-of-line (BEOL) techniques, resulting in extremely dense connectivity profiles. The resulting product is called an OmniDie.
An OmniDie™ smoothly intercepts the semiconductor supply chain at the OSAT (Outsourced Assembly and Test) level in that it can be packaged using standard or advanced packaging technologies as the system application demands.
With CrossFire’s OmniLithic Technology, Wafer Scale Heterogeneous SoCs can be manufactured and then packaged without an interposer using low cost standard packaging solutions, providing connectivity equivalent to 3D capabilities using 2D techniques.
Organic Interconnect bridge™
CrossFire’s Organic Interconnect Bridge (OIB) creates system connectivity first - again utilizing standard semiconductor BEOL techniques - to create an organic thin film connectivity bridge. An OIB allows die equipped with commonly used bumps and copper pillars to be used with CrossFire’s Direct Chiplet Interface™ (DCI) equipped. OIB is a perfect solution for connecting the huge 25 micro and above pitches of UCIe or BOW without the cost of silicon interposers or embedded bridges.
In addition to passive connectivity use cases, OIB allows the use of semiconductors such as ASSPs in die form, Chiplets, and passive components. The OIB also supports the use of packaged parts such as Chip Scale Packages (CSPs) and Ball Grid Arrays (BGAs). When combined with a typical organic substrate, OIB can be an excellent choice for developing System in Package devices.
applications
CrossFire’s technology will provide higher density, lower development costs, and faster time to market than conventional semiconductor technology, key requirements for these critical applications:
· Artificial Intelligence (AI)
· Machine Learning / Deep Learning
· Autonomous vehicles / ADAS
· Edge computing / Data servers
· Military / Aerospace