Enabling the Open Chiplet Economy

Reduce Schedules, Eliminate the Interposer, Dramatically Improve D2D Interface

Chiplets are becoming ubiquitous in the Accelerated and Embedded Computing SoC markets. Unfortunately, several pain points are slowing the growth of the open Chiplet economy. The requirement and availability of expensive interposers, Die to Die Interfaces that consume excessive die area and add latency, and captive chiplet integration processes stand out as primary roadblocks for many customers.

CrossFire’s mission is to make the Chiplet ecosystem available to all. Foundry and flow agnostic, CrossFire offers a holistic and non-captive approach to Chiplet development and integration with a suite of products to shorten time to market and reduce costs.

The product suite includes, CrossFire’s Bridgelet™ which can shave up to a year off of development schedules as well as reduce valuable interface die area by 50x and lower power use by 10x with the included Direct Chiplet Interface™(DCI). CrossFire also offers OmniDie™, a unique approach to chiplet integration that does not require interposers or an expensive package laminate, which can shorten development schedules and reduce costs.

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Bridgelet
 Direct Chiplet Interface (DCI)


Features
 Benefits
 Features
 Benefits

Disaggregates system I/O from memory functions
Allows chiplet reuse within or across product families
Ultra Short Reach (<500µ)
Lower power and area; Higher performance 

Die scale interconnect (sub-micron)
Higher density and performance; Lower power
Protocol Agnostic
One PHY for multiple protocols

Enables “Beyond the Reticle” constraint
Extend SoC designs
Die Scale Interconnect (sub-micron)
Higher density and performance; Lower power



  

Reduce Development Costs and Schedules – Bridgelets

A Bridgelet is a Chiplet that enables customers to reuse existing IP with two different Die to Die interfaces as well as reduce interface die area by 50x. This can dramatically reduce SoC development and manufacturing costs while also accelerating time to market. A Bridgelet can also contain key system functionality such as UCIe or LPDDR5x interfaces connected to the main xPU Chiplet by an on-chip interface such as AMBA-AXI5 or AMBA-CHI that uses CrossFire’s Direct Chiplet Interface (DCI).

Improved Die to Die Interface – Direct Chiplet Interface (DCI)

Requiring less than 0.1mm**2 of die area to extend a 128-bit AMBA-AXI5 on-chip fabric between Chiplets, DCI minimizes both System and IC development costs and schedules. Requiring less than 100 Femto Joule per bit of transfer energy and adding practically zero latency, DCI is the ultimate Die to Die Interface solution.

Interposer Alternative – OmniDie

CrossFire has developed an approach to Chiplet Integration that does not require an Interposer or expensive ultra-fine pitch package laminate. The output of CrossFire’s OmniLithic Chiplet Integration Process creates a DIE – not a SiP. Chiplets integrated into an OmniDie are compatible with standard packaging, require no interposer, and support Wafer Scale Integration.

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